Abstract:
Electromagnetic radiation for a printed circuit board (PCB) midplane connector is studied in this paper. By applying integral-equation (IE) based method and characteristi...Show MoreMetadata
Abstract:
Electromagnetic radiation for a printed circuit board (PCB) midplane connector is studied in this paper. By applying integral-equation (IE) based method and characteristic mode (CM) analysis, the current is split into radiating and non-radiating ones. The radiated power from each part of the structure can be quantified using the radiating current. Therefore, the radiation hot spot can be identified for both edge-side coupled and broad-side coupled connectors. Furthermore, the radiation characteristics for these connectors are compared.
Published in: 2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)
Date of Conference: 07-11 August 2017
Date Added to IEEE Xplore: 23 October 2017
ISBN Information:
Electronic ISSN: 2158-1118
EMC Laboratory, Missouri University of Science and Technology, Rolla, MO, USA
University of Electronic Science and Technology, Chengdu, China
University of Electronic Science and Technology, Chengdu, China
EMC Laboratory, Missouri University of Science and Technology, Rolla, MO, USA
The University of Hong Kong, Hong Kong
EMC Laboratory, Missouri University of Science and Technology, Rolla, MO, USA
University of Electronic Science and Technology, Chengdu, China
University of Electronic Science and Technology, Chengdu, China
University of Electronic Science and Technology, Chengdu, China
EMC Laboratory, Missouri University of Science and Technology, Rolla, MO, USA
EMC Laboratory, Missouri University of Science and Technology, Rolla, MO, USA
Contents EMC Laboratory, Missouri University of Science and Technology, Rolla, MO, USA
University of Electronic Science and Technology, Chengdu, China
University of Electronic Science and Technology, Chengdu, China
EMC Laboratory, Missouri University of Science and Technology, Rolla, MO, USA
The University of Hong Kong, Hong Kong
EMC Laboratory, Missouri University of Science and Technology, Rolla, MO, USA
University of Electronic Science and Technology, Chengdu, China
University of Electronic Science and Technology, Chengdu, China
University of Electronic Science and Technology, Chengdu, China
EMC Laboratory, Missouri University of Science and Technology, Rolla, MO, USA
EMC Laboratory, Missouri University of Science and Technology, Rolla, MO, USA
