Abstract:
The work has fabricated flip-chip-bondable VCSELs for hybrid integration with atomic clock microsystems. A shallow surface relief in combination with a surface grating ar...Show MoreMetadata
Abstract:
The work has fabricated flip-chip-bondable VCSELs for hybrid integration with atomic clock microsystems. A shallow surface relief in combination with a surface grating are etched in an extra topmost GaAs quarter-wave antiphase layer in the VCSEL structure, which establishes an inverted grating relief
Published in: 2013 Conference on Lasers & Electro-Optics Europe & International Quantum Electronics Conference CLEO EUROPE/IQEC
Date of Conference: 12-16 May 2013
Date Added to IEEE Xplore: 21 April 2014
ISBN Information:
Institute of Optoelectronics, Ulm University, Ulm, Germany
Institute of Optoelectronics, Ulm University, Ulm, Germany
Institute of Optoelectronics, Ulm University, Ulm, Germany
Institute of Optoelectronics, Ulm University, Ulm, Germany
Contents Institute of Optoelectronics, Ulm University, Ulm, Germany
Institute of Optoelectronics, Ulm University, Ulm, Germany
Institute of Optoelectronics, Ulm University, Ulm, Germany
Institute of Optoelectronics, Ulm University, Ulm, Germany
