Abstract:
The work has fabricated flip-chip-bondable VCSELs for hybrid integration with atomic clock microsystems. A shallow surface relief in combination with a surface grating ar...Show MoreMetadata
Abstract:
The work has fabricated flip-chip-bondable VCSELs for hybrid integration with atomic clock microsystems. A shallow surface relief in combination with a surface grating are etched in an extra topmost GaAs quarter-wave antiphase layer in the VCSEL structure, which establishes an inverted grating relief
Published in: 2013 Conference on Lasers & Electro-Optics Europe & International Quantum Electronics Conference CLEO EUROPE/IQEC
Date of Conference: 12-16 May 2013
Date Added to IEEE Xplore: 21 April 2014
ISBN Information:
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