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Performance and power evaluation of a 3D CMOS/nanomaterial reconfigurable architecture | IEEE Conference Publication | IEEE Xplore

Performance and power evaluation of a 3D CMOS/nanomaterial reconfigurable architecture


Abstract:

In this paper, we introduce a novel reconfigurable architecture, named 3D nFPGA, which utilizes 3D integration techniques and new nanoscale materials synergistically. The...Show More

Abstract:

In this paper, we introduce a novel reconfigurable architecture, named 3D nFPGA, which utilizes 3D integration techniques and new nanoscale materials synergistically. The proposed architecture is based on CMOS-nano hybrid techniques that incorporate nanomaterials such as carbon nanotube bundles and nanowire crossbars into CMOS fabrication process. Using unique features of FPGAs and a novel 3D stacking method enabled by the application of nanomaterials, 3D nFPGA obtains a 4.5X footprint reduction compared to traditional CMOS-based 2D FPGAs. With a customized design automation flow, we evaluate the performance and power of 3D nFPGA driven by the 20 largest MCNC benchmarks. Results demonstrate that 3D nFPGA is able to provide a performance gain of 2.6X with a small power overhead comparing to the CMOS 2D FPGA architecture.
Date of Conference: 04-08 November 2007
Date Added to IEEE Xplore: 10 December 2007
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Conference Location: San Jose, CA
Department of Electrical and Computer Engineering, University of Illinois, Urbana-Champaign, USA
Department of Electrical and Computer Engineering, University of Illinois, Urbana-Champaign, USA
Department of Electrical and Computer Engineering, Purdue University, Indiana University, Indianapolis, USA
Department of Electrical and Computer Engineering, Purdue University, Indiana University, Indianapolis, USA

Department of Electrical and Computer Engineering, University of Illinois, Urbana-Champaign, USA
Department of Electrical and Computer Engineering, University of Illinois, Urbana-Champaign, USA
Department of Electrical and Computer Engineering, Purdue University, Indiana University, Indianapolis, USA
Department of Electrical and Computer Engineering, Purdue University, Indiana University, Indianapolis, USA
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