Abstract:
We report on p-channel metal-insulator-semiconductor heterostructure field-effect transistors (MISHFET) based on p-GaN/uid-GaN/Al textsubscript 0.29Ga textsubscript 0.71N...Show MoreMetadata
Abstract:
We report on p-channel metal-insulator-semiconductor heterostructure field-effect transistors (MISHFET) based on p-GaN/uid-GaN/Al textsubscript 0.29Ga textsubscript 0.71N single heterostructures on sapphire substrates, grown by metalorganic vapor phase epitaxy (MOVPE). The impact of p-GaN layer removal and channel layer thickness adjustment by dry-etching on the characteristics of the MISHFET are investigated. Depending on the remaining GaN thickness (t_{\mathrm{ GaN}}) , the fabricated MISHFET show either depletion-mode (d-mode) operation with a threshold voltage V_{\mathrm{ th}} of 3.8 V and an on-current \unicode{0x007C}I_{\mathrm{ D,on}} \unicode{0x007C} of 9.5 mA/mm ( t_{\mathrm{ GaN}} = 21 nm) or enhancement-mode (e-mode) operation with V_{\mathrm{ th}} of −2.3 V and \unicode{0x007C}I_{\mathrm{ D,on}} \unicode{0x007C} of 1.5 mA/mm ( t_{\mathrm{ GaN}}= 12 nm). Independent of the etching depth, all devices exhibit a very low off-state drain current \left|I_{\mathrm{D}, \mathrm{off}}\right| \sim 10^{-8} mA/mm and a steep subthreshold swing (SS) between 80 and 89 mV/dec. Similar to n-channel devices, a V_{th} instability caused by charge trapping at the dielectric/semiconductor interface is found, emphasizing that careful interface engineering is required for good device performance.
Published in: IEEE Journal of the Electron Devices Society ( Volume: 11)