Methodology of Development Robust 2nd Bond on Ultra-Thin Plating

After 50 years of wire bonding history, the evolution of packaging improvement has become more challenging. Technical breakthrough is needed to achieve better cost saving measures & quality improvement. New Ultra-Thin Plating technique invented by ST with the objective to achieve both costs saving & reliability improvement. On wire bond aspect, a new methodology was explored to adapt challenges encountered. Other than machine parameter optimization, clamping tool played a vital role in this breakthrough. To achieve robust 2nd bond response, the window clamp & top plate design stage is crucial & simulation approach can improve in terms of visibility & effectiveness. New criteria of clamping tool buyoff has been introduced for robust clamping condition buyoff. In this technical paper, the methodology of developing robust 2nd bond together with clamping tool design was demonstrated.