Abstract:
There are indelible challenges related to transistor action and realization of emerging two-dimensional van der Waals (vdW) multilayer (2D _{{\mathrm {ml}}} ) field-eff...Show MoreMetadata
Abstract:
There are indelible challenges related to transistor action and realization of emerging two-dimensional van der Waals (vdW) multilayer (2D _{{\mathrm {ml}}} ) field-effect transistors (FETs), to the post silicon technology era. For scalability, a cost-effective large area ultrafine thin films interface and band alignment of multilayer channel material with compatible gate dielectric are essential. Here, 2D _{{\mathrm {ml}}} hafnium disulfide (HfS2) and ZrO2 are employed as channel material and gate dielectric, respectively, and anticipated that vdW interaction of said structures entails the high-quality interface with trivial dangling bonds and defects caused by lattice mismatch. The investigated Al/ZrO2/HfS2/Al _{\mu {\text{-IDE}}} FETs exhibit the subthreshold swing (SS) ~65 mV/dec, {I}_{ \mathrm{\scriptscriptstyle ON}}/I_{ \mathrm{\scriptscriptstyle OFF}} ratio of ~104, transconductance of ~3.99 \mu \text{S} , effective mobility of ~74 cm2/Vs at {V}_{{\mathrm {gs}}} of 2 V, and leakage current density of ~33.8 nA/cm2 at {V}_{{\mathrm {gs}}} of −1 V. Thus, the steep SS, sturdy current saturation, low-voltage operation (~3 V), and leakage current establish the potential candidature of HfS2 and ZrO2-based 2-D FETs for both conventional and ubiquitous electronics.
Published in: IEEE Transactions on Electron Devices ( Volume: 70, Issue: 4, April 2023)