SiC automotive power module with laser welded, ultra low inductive terminals and up to 900Arms phase current

Electric Vehicles (EV) and Hybrid Electric Vehicles (HEV) are the fastest growing and most challenging market for power electronic components. Power density, reliability and cost have always been the main drivers for vehicle applications. Due to high battery cost and the need to increase the driving range of EV, efficiency has become a major focus of new developments. The way forward for large electric vehicles will be based on SiC MOSFET inverters with DC link voltages of up to 800V. Ultra high peak currents, fast switching transients, highest reliability and fast assembly drive the need for minimum stray inductance of power module and the matching DC-Link capacitor as well as innovative joining technologies such as chip sintering and laser welding for the main power terminals. The new power module family can incorporate up to 10 parallel SiC MOSFET chips, with a total module stray inductance of 2.5nH . It has no screw based power terminals, all high power connections inside the module to the DBC substrate as well as outside of the module to the busbars are laser welded for up to 900Arms output current.