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Universal Smart Power Module (USPM) for Carbon Neutral Society | IEEE Conference Publication | IEEE Xplore

Universal Smart Power Module (USPM) for Carbon Neutral Society


Abstract:

The concept and results of the Universal Smart Power Module (USPM), which can respond instantaneously to fluctuating power sources such as solar and wind power, and can f...Show More

Abstract:

The concept and results of the Universal Smart Power Module (USPM), which can respond instantaneously to fluctuating power sources such as solar and wind power, and can fully address the rapidly expanding renewable energy market by combining universality and smartness, will be explained. The built-in controller of the USPM can respond (feedback) to command values received from the master controller at high speed and with high precision, thus enabling high-speed control of fluctuating power sources. In addition to a power conversion main circuit and a high-speed controller, the USPM consists of a gate driver and an EMI filter. This means that the USPM features simplified power electronics design. Conventional power electronics design requires a variety of know-how and specialized skills. USPM can simplify the design of power electronic systems because it can be configured by simply connecting variations of USPM. The core power module that consists of the USPM was made ultra-compact to create the universality that is a feature of the USPM. As the technology for ultra-miniaturization, ADB (Atomic Diffusion Bonding) was developed and applied to the drain side of the SiC-MOSFET to achieve low thermal resistance, and bumping technology to the source side of it to achieve low inductance. The newly developed core power module is approximately 1/3 the volume of a general-purpose Si-IGBT module. The USPM, which can easily configure power electronics products, and the ultra-compact core power module, which enables the realization of USPM, will contribute to the realization of a carbon-neutral society.
Date of Conference: 15-19 May 2022
Date Added to IEEE Xplore: 01 July 2022
ISBN Information:
Conference Location: Himeji, Japan

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