Research on Thermal Design of an Airborne Electronic Equipment with High Heat Consumption

A thermal design of high heat consumption airborne electronic equipment is introduced. The internal flow field and heating devices of the module are simulated and analyzed by using FloEFD. The results show that under the condition of forced air cooling, when the square heat dissipation spoiler column with side length of 3 mm is spaced at $3\ \text{mm}\times 5\ \text{mm}$ (3 mm perpendicular to the wind direction and 5mm parallel to the wind direction), the heat dissipation capacity of the module is the best. The test results verify the correctness of the simulation results, which can provide a reference for the thermal design of similar airborne electronic equipment.