PCB embedded magnetic technology and design implementation

With the development of PCB industry into the system packaging (SOP) stage, and the development of power electronic magnetic devices to high-frequency and miniaturization, PCB embedded magnetic materials has become an important direction to solve the system integration of magnetic devices. This paper introduces the technology of embedded magnetic materials in PCB, and focuses on the design and simulation of embedded magnetic device in PCB. Magnetic materials are embedded into PCB through grooving, embedding, filling and pressing, and then circuit interconnection is realized through drilling, electroplating and etching to form embedded magnetic devices. Different from traditional winding implementation, PCB embedded magnetic design requires magnetic inductance, winding number and current carrying capacity calculation, and three-dimensional electromagnetic field overall electrical performance simulation. In the design process, it is considered to increase capacitance to match the impedance of the overall signal transmission link, reduce distributed capacitance to improve common-mode rejection ratio to reduce EMC risk, the output end is far away from the input end to facilitate port isolation and signal transmission, and add exhaust holes to avoid the thermal expansion and layer of PCB as a whole. In addition, this paper introduces the challenges and solutions of PCB embedded magnetic technology. In this paper, the discussion of PCB embedded magnetic technology and design implementation is conducive to increase the understanding of industry engineers on PCB embedded magnetic technology and design.