Flexible Parametric Speaker with Ultra-Thin PZT/Si MEMS Chips Integrated On Paper Substrate

In this paper, we report on the integration of an ultra-thin PZT/Si chip on a paper substrate, which functions as a simple speaker by applying a voltage in the audible frequency range. The PZT/Si chip used is very thin, only 5 µm thick, so it does not interfere with the flexibility of the substrate, and the electrode connection process does not use a high temperature process, allowing integration on paper. This technology is expected to be applied to electronic paper, electronic components for smartphone surrounds, and flexible parametric speakers.