3D X-ray Microscope (XRM) Applied to Semiconductor Embedded in Substrate Defect Analysis

This paper describes the non-destructive imaging using 3D X-ray microscopy (XRM) for Semiconductor Embedded in Substrate (SESUB) failure analysis. XRM is able to generate 3D views and 2D virtual images, such as via and layout of each layer of the circuit. [1] Three cases are explained how to identify and locate failures embedded deep inside the SEUB with 3D XRM, such as a trace broken, micro via (m-VIA) poor-opening within a SESUB package. [2]