Abstract:
This paper describes the non-destructive imaging using 3D X-ray microscopy (XRM) for Semiconductor Embedded in Substrate (SESUB) failure analysis. XRM is able to generate...Show MoreMetadata
Abstract:
This paper describes the non-destructive imaging using 3D X-ray microscopy (XRM) for Semiconductor Embedded in Substrate (SESUB) failure analysis. XRM is able to generate 3D views and 2D virtual images, such as via and layout of each layer of the circuit. [1] Three cases are explained how to identify and locate failures embedded deep inside the SEUB with 3D XRM, such as a trace broken, micro via (m-VIA) poor-opening within a SESUB package. [2]
Published in: 2021 16th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
Date of Conference: 21-23 December 2021
Date Added to IEEE Xplore: 08 February 2022
ISBN Information:
Contents 