Optimization of Laser Marking Process on Microelectronic Packages for Aerospace Applications

LASER based package marking process is developed and implemented for identification of HMC and MMIC based modules for aerospace applications. Marking of these modules is used for identification and traceability of the manufacturer, component type, date code, serial number and electrical connection details of the module being used in the aerospace system. The main challenge in laser marking process is to have relative engraving without exposing the base material. As the HMC package lids are having coating of nickel and gold over kovar/aluminium, so exposure of base material may lead to contamination detrimental to the ensured performance. The aim of this study is optimization of laser marking process parameters and evaluation of the laser marking process on microelectronics packages for aerospace applications. Visual and microscope evaluation of the marked samples are carried out to enhance marking text on HMC and MMIC package lids.