MAXQFP: NXP new package platform

172-lead (16x16 mm body size) and 100-lead (10x10 mm body size) MAXQFP’s and 172 MAXQFP-EP (exposed pad) for automotive industry are introduced. The advantage o MAXQFP as compare to standard LQFP/QFP packages will be outlined. Thermal & mechanical simulation results were performed to prove its advantage over conventional LQFP and $\mathrm{L}\mathrm{Q}\mathrm{F}\mathrm{P}_{-}\mathrm{E}\mathrm{P}$. Electrical simulation results are also shown MaXQFP’s advantage over traditional LQFP parts. The challenges in manufacturing, designs and concerns of tighter lead pitches for MAXQFP are briefly addressed. Sn whisker and Sn migration both are concerns to MAXQFP because of smaller distance between adjacent leads and their results will be shown. The board-level solder joint reliability (SJR) has been collected to prove it is AEC Gl compliant. Visual inspection methods and requirements on AOI (automatic object inspection) systems on solider joints of J-leads of MAXQFP are proposed. Standard AEC Gl component level reliability stresses defined at AEC Q100 which are TC (temperature cycling), HTSL (high temperature storage life), THB (Temperature Humidity Biased) and uHAST (un-biased HAST) tests are summarized Since Cu wires were used, AEC Q006 data are also collected. Assembly challenges are briefly described. Future works will also be summarized.