Structural, Electrical and Mechanical Behavior of Thin Copper Coatings Obtained by Various Electrodeposition Processes | IEEE Conference Publication | IEEE Xplore

Structural, Electrical and Mechanical Behavior of Thin Copper Coatings Obtained by Various Electrodeposition Processes


Abstract:

Electrochemically deposited copper coatings obtained from sulfate baths on brass substrates in the regime of direct current (DC) with and without an application of ultras...Show More

Abstract:

Electrochemically deposited copper coatings obtained from sulfate baths on brass substrates in the regime of direct current (DC) with and without an application of ultrasound mixing of electrolytes (DC/US) have been studied. The aim of the research was analysis of the influence of current density, ultrasonic mixing of electrolyte and presence of additives on the electrodeposited coatings, in order to obtain uniform compact coatings suitable for potential application in MEMS devices. Structural, electrical and mechanical behavior of thin copper coatings were investigated using SEM, AFM, four- point probe method and Vickers hardness test.
Date of Conference: 12-14 September 2021
Date Added to IEEE Xplore: 25 October 2021
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Conference Location: Nis, Serbia

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