Learning-Based THz Multi-Layer Imaging for High-Capacity Positioning | IEEE Conference Publication | IEEE Xplore

Learning-Based THz Multi-Layer Imaging for High-Capacity Positioning


Abstract:

This paper considers terahertz (THz) multi-layer imaging for three-dimensional (3D) positioning and encoders. A learning-based approach is introduced to address challenge...Show More

Abstract:

This paper considers terahertz (THz) multi-layer imaging for three-dimensional (3D) positioning and encoders. A learning-based approach is introduced to address challenges such as 1) depth variation, 2) shadowing effect, and 3) content recognition at the back surface of each layer. Experimental validation on a three-layer sample with contents on both front and back surfaces confirms the effectiveness of the proposed approach.
Date of Conference: 29 August 2021 - 03 September 2021
Date Added to IEEE Xplore: 20 October 2021
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Conference Location: Chengdu, China
Mitsubishi Electric Research Laboratories, Cambridge, MA, USA
Mitsubishi Electric Research Laboratories, Cambridge, MA, USA
Mitsubishi Electric Research Laboratories, Cambridge, MA, USA
Mitsubishi Electric Research Laboratories, Cambridge, MA, USA
Mitsubishi Electric Corporation Advanced Technology R&D Center, Amagasaki City, Japan
Mitsubishi Electric Corporation Advanced Technology R&D Center, Amagasaki City, Japan
Institute of Laser Engineering, Osaka University, Osaka, Japan

Mitsubishi Electric Research Laboratories, Cambridge, MA, USA
Mitsubishi Electric Research Laboratories, Cambridge, MA, USA
Mitsubishi Electric Research Laboratories, Cambridge, MA, USA
Mitsubishi Electric Research Laboratories, Cambridge, MA, USA
Mitsubishi Electric Corporation Advanced Technology R&D Center, Amagasaki City, Japan
Mitsubishi Electric Corporation Advanced Technology R&D Center, Amagasaki City, Japan
Institute of Laser Engineering, Osaka University, Osaka, Japan

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