Abstract:
This paper considers terahertz (THz) multi-layer imaging for three-dimensional (3D) positioning and encoders. A learning-based approach is introduced to address challenge...Show MoreMetadata
Abstract:
This paper considers terahertz (THz) multi-layer imaging for three-dimensional (3D) positioning and encoders. A learning-based approach is introduced to address challenges such as 1) depth variation, 2) shadowing effect, and 3) content recognition at the back surface of each layer. Experimental validation on a three-layer sample with contents on both front and back surfaces confirms the effectiveness of the proposed approach.
Published in: 2021 46th International Conference on Infrared, Millimeter and Terahertz Waves (IRMMW-THz)
Date of Conference: 29 August 2021 - 03 September 2021
Date Added to IEEE Xplore: 20 October 2021
ISBN Information:
ISSN Information:
Mitsubishi Electric Research Laboratories, Cambridge, MA, USA
Mitsubishi Electric Research Laboratories, Cambridge, MA, USA
Mitsubishi Electric Research Laboratories, Cambridge, MA, USA
Mitsubishi Electric Research Laboratories, Cambridge, MA, USA
Mitsubishi Electric Corporation Advanced Technology R&D Center, Amagasaki City, Japan
Mitsubishi Electric Corporation Advanced Technology R&D Center, Amagasaki City, Japan
Institute of Laser Engineering, Osaka University, Osaka, Japan
Contents Mitsubishi Electric Research Laboratories, Cambridge, MA, USA
Mitsubishi Electric Research Laboratories, Cambridge, MA, USA
Mitsubishi Electric Research Laboratories, Cambridge, MA, USA
Mitsubishi Electric Research Laboratories, Cambridge, MA, USA
Mitsubishi Electric Corporation Advanced Technology R&D Center, Amagasaki City, Japan
Mitsubishi Electric Corporation Advanced Technology R&D Center, Amagasaki City, Japan
Institute of Laser Engineering, Osaka University, Osaka, Japan
