Abstract:
We have engineered dual gate WS2 transistors with scaled top and back gate stacks based on a surface physisorption ALD approach for advanced logic applications. Connected...Show MoreMetadata
Abstract:
We have engineered dual gate WS2 transistors with scaled top and back gate stacks based on a surface physisorption ALD approach for advanced logic applications. Connected dual gate MOSFET operation with a 2ML WS2 channel reaches 210μA/um drain current and 2.7μF/cm2 capacitance (>3.4×1013/cm2 sheet charge density) at 3V gate bias, with >108 on-off ratio, 120μS/um max. transconductance and 109mV/dec sub-threshold swing at 100nm Lch. This dual gate design enables us to explore EOT scaling, ambipolar I-V and C-V(capacitance-voltage) response on CVD WS2 channel.
Published in: 2020 IEEE International Electron Devices Meeting (IEDM)
Date of Conference: 12-18 December 2020
Date Added to IEEE Xplore: 11 March 2021
ISBN Information: