Loading [MathJax]/extensions/MathZoom.js
A Perturbative Stochastic Galerkin Method for the Uncertainty Quantification of Linear Circuits | IEEE Journals & Magazine | IEEE Xplore

A Perturbative Stochastic Galerkin Method for the Uncertainty Quantification of Linear Circuits


Abstract:

This paper presents an iterative and decoupled perturbative stochastic Galerkin (SG) method for the variability analysis of stochastic linear circuits with a large number...Show More

Abstract:

This paper presents an iterative and decoupled perturbative stochastic Galerkin (SG) method for the variability analysis of stochastic linear circuits with a large number of uncertain parameters. State-of-the-art implementations of polynomial chaos expansion and SG projection produce a large deterministic circuit that is fully coupled, thus becoming cumbersome to implement and inefficient to solve when the number of random parameters is large. In a perturbative approach, component variability is interpreted as a perturbation of its nominal value. The relaxation of the resulting equations and the application of a SG method lead to a decoupled system of equations, corresponding to a modified equivalent circuit in which each stochastic component is replaced by the nominal element equipped with a parallel current source accounting for the effect of variability. The solution of the perturbation problem is carried out in an iterative manner by suitably updating the equivalent current sources by means of Jacobi- or Gauss-Seidel strategies, until convergence is reached. A sparse implementation allows avoiding the refinement of negligible coefficients, yielding further efficiency improvement. Moreover, for time-invariant circuits, the iterations are effectively performed in post-processing after characterizing the circuit in time or frequency domain by means of a limited number of simulations. Several application examples are used to illustrate the proposed technique and highlight its performance and computational advantages.
Published in: IEEE Transactions on Circuits and Systems I: Regular Papers ( Volume: 67, Issue: 9, September 2020)
Page(s): 2993 - 3006
Date of Publication: 23 April 2020

ISSN Information:

Author image of Paolo Manfredi
Department of Electronics and Telecommunications, EMC Group, Politecnico di Torino, Turin, Italy
Paolo Manfredi (Senior Member, IEEE) received the M.Sc. degree in electronic engineering from the Politecnico di Torino, Turin, Italy, in 2009, and the Ph.D. degree in information and communication technology from the Scuola Interpolitecnica di Dottorato, Politecnico di Torino, in 2013.
From 2013 to 2014, he was a Post-Doctoral Researcher at the EMC Group, Politecnico di Torino. From 2014 to 2017, he was a Post-Doctoral Re...Show More
Paolo Manfredi (Senior Member, IEEE) received the M.Sc. degree in electronic engineering from the Politecnico di Torino, Turin, Italy, in 2009, and the Ph.D. degree in information and communication technology from the Scuola Interpolitecnica di Dottorato, Politecnico di Torino, in 2013.
From 2013 to 2014, he was a Post-Doctoral Researcher at the EMC Group, Politecnico di Torino. From 2014 to 2017, he was a Post-Doctoral Re...View more
Author image of Riccardo Trinchero
Department of Electronics and Telecommunications, EMC Group, Politecnico di Torino, Turin, Italy
Riccardo Trinchero (Member, IEEE) received the M.Sc. and Ph.D. degrees in electronics and communication engineering from the Politecnico di Torino, Turin, Italy, in 2011 and 2015, respectively.
He is currently an Assistant Professor with the EMC Group with the Department of Electronics and Telecommunications, Politecnico di Torino. His research interests include the analysis of linear time-varying systems, modeling and sim...Show More
Riccardo Trinchero (Member, IEEE) received the M.Sc. and Ph.D. degrees in electronics and communication engineering from the Politecnico di Torino, Turin, Italy, in 2011 and 2015, respectively.
He is currently an Assistant Professor with the EMC Group with the Department of Electronics and Telecommunications, Politecnico di Torino. His research interests include the analysis of linear time-varying systems, modeling and sim...View more
Author image of Dries Vande Ginste
Department of Information Technology, Electromagnetics Group, Ghent University-imec, Ghent, Belgium
Dries Vande Ginste (Senior Member, IEEE) received the M.S. and Ph.D. degrees in electrical engineering from Ghent University, Ghent, Belgium, in 2000 and 2005, respectively.
He is currently an Associate Professor with the Department of Information Technology, Ghent University, and a Guest Professor at imec. In June and July 2004, he was a Visiting Scientist at the Department of Electrical and Computer Engineering, Universi...Show More
Dries Vande Ginste (Senior Member, IEEE) received the M.S. and Ph.D. degrees in electrical engineering from Ghent University, Ghent, Belgium, in 2000 and 2005, respectively.
He is currently an Associate Professor with the Department of Information Technology, Ghent University, and a Guest Professor at imec. In June and July 2004, he was a Visiting Scientist at the Department of Electrical and Computer Engineering, Universi...View more

Author image of Paolo Manfredi
Department of Electronics and Telecommunications, EMC Group, Politecnico di Torino, Turin, Italy
Paolo Manfredi (Senior Member, IEEE) received the M.Sc. degree in electronic engineering from the Politecnico di Torino, Turin, Italy, in 2009, and the Ph.D. degree in information and communication technology from the Scuola Interpolitecnica di Dottorato, Politecnico di Torino, in 2013.
From 2013 to 2014, he was a Post-Doctoral Researcher at the EMC Group, Politecnico di Torino. From 2014 to 2017, he was a Post-Doctoral Research Fellow of the Research Foundation–Flanders (FWO) with the Electromagnetics Group, Department of Information Technology, Ghent University, Ghent, Belgium. He is currently an Assistant Professor with the EMC Group, Department of Electronics and Telecommunications, Politecnico di Torino. His research interests comprise the several aspects of the circuit and interconnect modeling and simulation, including statistical and worst-case analysis, signal integrity, and electromagnetic compatibility.
Dr. Manfredi was a recipient of the Outstanding Young Scientist Award at the 2018 Joint IEEE International Symposium on Electromagnetic Compatibility & Asia-Pacific Symposium on Electromagnetic Compatibility, the Best Paper Award at the 2016 IEEE Electrical Design of Advanced Packaging and Systems Symposium, the Best Oral Paper Award and the Best Student Paper Award at the 22nd and 19th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, respectively, the Young Scientist Award at the XXX International Union of Radio Science General Assembly and Scientific Symposium, and an Honorable Mention at the 2011 IEEE Microwave Theory and Techniques Society International Microwave Symposium.
Paolo Manfredi (Senior Member, IEEE) received the M.Sc. degree in electronic engineering from the Politecnico di Torino, Turin, Italy, in 2009, and the Ph.D. degree in information and communication technology from the Scuola Interpolitecnica di Dottorato, Politecnico di Torino, in 2013.
From 2013 to 2014, he was a Post-Doctoral Researcher at the EMC Group, Politecnico di Torino. From 2014 to 2017, he was a Post-Doctoral Research Fellow of the Research Foundation–Flanders (FWO) with the Electromagnetics Group, Department of Information Technology, Ghent University, Ghent, Belgium. He is currently an Assistant Professor with the EMC Group, Department of Electronics and Telecommunications, Politecnico di Torino. His research interests comprise the several aspects of the circuit and interconnect modeling and simulation, including statistical and worst-case analysis, signal integrity, and electromagnetic compatibility.
Dr. Manfredi was a recipient of the Outstanding Young Scientist Award at the 2018 Joint IEEE International Symposium on Electromagnetic Compatibility & Asia-Pacific Symposium on Electromagnetic Compatibility, the Best Paper Award at the 2016 IEEE Electrical Design of Advanced Packaging and Systems Symposium, the Best Oral Paper Award and the Best Student Paper Award at the 22nd and 19th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, respectively, the Young Scientist Award at the XXX International Union of Radio Science General Assembly and Scientific Symposium, and an Honorable Mention at the 2011 IEEE Microwave Theory and Techniques Society International Microwave Symposium.View more
Author image of Riccardo Trinchero
Department of Electronics and Telecommunications, EMC Group, Politecnico di Torino, Turin, Italy
Riccardo Trinchero (Member, IEEE) received the M.Sc. and Ph.D. degrees in electronics and communication engineering from the Politecnico di Torino, Turin, Italy, in 2011 and 2015, respectively.
He is currently an Assistant Professor with the EMC Group with the Department of Electronics and Telecommunications, Politecnico di Torino. His research interests include the analysis of linear time-varying systems, modeling and simulation of switching converters, and statistical simulation of circuits and systems.
Riccardo Trinchero (Member, IEEE) received the M.Sc. and Ph.D. degrees in electronics and communication engineering from the Politecnico di Torino, Turin, Italy, in 2011 and 2015, respectively.
He is currently an Assistant Professor with the EMC Group with the Department of Electronics and Telecommunications, Politecnico di Torino. His research interests include the analysis of linear time-varying systems, modeling and simulation of switching converters, and statistical simulation of circuits and systems.View more
Author image of Dries Vande Ginste
Department of Information Technology, Electromagnetics Group, Ghent University-imec, Ghent, Belgium
Dries Vande Ginste (Senior Member, IEEE) received the M.S. and Ph.D. degrees in electrical engineering from Ghent University, Ghent, Belgium, in 2000 and 2005, respectively.
He is currently an Associate Professor with the Department of Information Technology, Ghent University, and a Guest Professor at imec. In June and July 2004, he was a Visiting Scientist at the Department of Electrical and Computer Engineering, University of Illinois at Urbana-Champaign (UIUC), Urbana-Champaign, IL, USA. From September to November 2011, he was a Visiting Professor at the EMC Group, Dipartimento di Elettronica, Politecnico di Torino, Italy. He has authored or coauthored over 200 papers in international journals and conference proceedings. His research interests include computational electromagnetics, electromagnetic compatibility, signal and power integrity, and antenna design.
Dr. Vande Ginste was awarded the International Union of Radio Science (URSI) Young Scientist Award at the 2011 URSI General Assembly and Scientific Symposium, the Best Poster Paper Award at the 2012 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), the Best Paper Award at the 2013 IEEE Workshop on Signal and Power Integrity (SPI), the Best Paper Award at the 2013 IEEE International Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), and the Best Paper Award at the 2016 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS). He has served as the Chair of the 2014 IEEE Workshop on Signal and Power Integrity. He is a Senior Member of the IEEE.
Dries Vande Ginste (Senior Member, IEEE) received the M.S. and Ph.D. degrees in electrical engineering from Ghent University, Ghent, Belgium, in 2000 and 2005, respectively.
He is currently an Associate Professor with the Department of Information Technology, Ghent University, and a Guest Professor at imec. In June and July 2004, he was a Visiting Scientist at the Department of Electrical and Computer Engineering, University of Illinois at Urbana-Champaign (UIUC), Urbana-Champaign, IL, USA. From September to November 2011, he was a Visiting Professor at the EMC Group, Dipartimento di Elettronica, Politecnico di Torino, Italy. He has authored or coauthored over 200 papers in international journals and conference proceedings. His research interests include computational electromagnetics, electromagnetic compatibility, signal and power integrity, and antenna design.
Dr. Vande Ginste was awarded the International Union of Radio Science (URSI) Young Scientist Award at the 2011 URSI General Assembly and Scientific Symposium, the Best Poster Paper Award at the 2012 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), the Best Paper Award at the 2013 IEEE Workshop on Signal and Power Integrity (SPI), the Best Paper Award at the 2013 IEEE International Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), and the Best Paper Award at the 2016 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS). He has served as the Chair of the 2014 IEEE Workshop on Signal and Power Integrity. He is a Senior Member of the IEEE.View more

Contact IEEE to Subscribe

References

References is not available for this document.