Abstract:
This letter proposes an artificial intelligence-aided thermal model for power electronic devices/systems considering thermal cross-coupling effects. Since multiple heat s...Show MoreMetadata
Abstract:
This letter proposes an artificial intelligence-aided thermal model for power electronic devices/systems considering thermal cross-coupling effects. Since multiple heat sources can be applied simultaneously in the thermal system, the proposed method is able to characterize model parameters more conveniently compared to existing methods where only single heat source is allowed at a time. By employing simultaneous cooling curves, linear-to-logarithmic data re-sampling, and differentiated power losses, the proposed artificial neural network-based thermal model can be trained with better data richness and diversity while using fewer measurements. Finally, experimental verifications are conducted to validate the model capabilities.
Published in: IEEE Transactions on Power Electronics ( Volume: 35, Issue: 10, October 2020)
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- IEEE Keywords
- Index Terms
- Artificial Model ,
- Thermal Model ,
- Cross-coupling Effect ,
- Power Loss ,
- Experimental Verification ,
- Heat Source ,
- Power Electronics ,
- Thermal System ,
- Time Interval ,
- Logarithm ,
- Training Data ,
- Estimation Error ,
- Artificial Neural Network ,
- Sampling Frequency ,
- Hidden Layer ,
- Thermal Resistance ,
- Thermal Characteristics ,
- Power Devices ,
- Artificial Neural Network Model ,
- Insulated Gate Bipolar Transistor ,
- Heterogeneous Integration ,
- ANN-based Model ,
- Power Electronic Systems ,
- Junction Temperature ,
- Conventional Matrix ,
- Artificial Neural Network Algorithm ,
- Artificial Neural Network Method ,
- Semiconductor Chip ,
- Time Series Problems
- Author Keywords
Keywords assist with retrieval of results and provide a means to discovering other relevant content. Learn more.
- IEEE Keywords
- Index Terms
- Artificial Model ,
- Thermal Model ,
- Cross-coupling Effect ,
- Power Loss ,
- Experimental Verification ,
- Heat Source ,
- Power Electronics ,
- Thermal System ,
- Time Interval ,
- Logarithm ,
- Training Data ,
- Estimation Error ,
- Artificial Neural Network ,
- Sampling Frequency ,
- Hidden Layer ,
- Thermal Resistance ,
- Thermal Characteristics ,
- Power Devices ,
- Artificial Neural Network Model ,
- Insulated Gate Bipolar Transistor ,
- Heterogeneous Integration ,
- ANN-based Model ,
- Power Electronic Systems ,
- Junction Temperature ,
- Conventional Matrix ,
- Artificial Neural Network Algorithm ,
- Artificial Neural Network Method ,
- Semiconductor Chip ,
- Time Series Problems
- Author Keywords