Abstract:
We report on p and n-type vertical gate-all-around (GAA) nanowire (NW) and nanosheet (NS) FETs which offer attractive opportunities for ultra-scaled circuits. An in-depth...Show MoreMetadata
Abstract:
We report on p and n-type vertical gate-all-around (GAA) nanowire (NW) and nanosheet (NS) FETs which offer attractive opportunities for ultra-scaled circuits. An in-depth evaluation is presented on the impact of doping and key device dimensions to improve the performance, variability, noise and reliability behavior for junctionless (JL) vs. inversion-mode (IM) vertical FETs built with an RMG scheme. The latter enables a novel concept to introduce stress in VFETs for enhanced mobility with up to a19% higher ION predicted. SiGe/Si pillars and self-aligned spacers offer a solution to gate vertical (mis)alignment towards the S/D. As MRAM selector, VNS FETs can allow substantial area reduction (64% for 2VNS per cell; 3nm node design rules) vs. finFET based cells, with smaller read/write energy consumption and latency times.
Published in: 2019 IEEE International Electron Devices Meeting (IEDM)
Date of Conference: 07-11 December 2019
Date Added to IEEE Xplore: 13 February 2020
ISBN Information: