Abstract:
The availability of on-chip sources with high degree of accuracy able to probe the response of the x-ray imaging detectors in all the conditions foreseen at the European ...Show MoreMetadata
Abstract:
The availability of on-chip sources with high degree of accuracy able to probe the response of the x-ray imaging detectors in all the conditions foreseen at the European XFEL is a key issue in order to implement automated procedures in order to trim gain and offset of each individual pixel channel to the desired target gain mode with the required degree of accuracy at the XFEL beamline/experiment. In the F2 readout ASIC of the DSSC instrument (DEPFET Sensor with Signal Compression) an improved 13 bit voltage DAC coupled to an electrical injection circuit has been implemented. A thorough measurement campaign to qualify the F2 DAC and the injected charge was conducted on a 64×64 miniSDD-F2 chip as a function of all relevant parameters.
Published in: 2018 IEEE Nuclear Science Symposium and Medical Imaging Conference Proceedings (NSS/MIC)
Date of Conference: 10-17 November 2018
Date Added to IEEE Xplore: 05 September 2019
ISBN Information:
ISSN Information:
Politecnico di Milano, Informazione e Bioingegneria and INFN, Sezione di Milano, Milano, Italy
Politecnico di Milano, Informazione e Bioingegneria and INFN, Sezione di Milano, Milano, Italy
Politecnico di Milano, Informazione e Bioingegneria and INFN, Sezione di Milano, Milano, Italy
European XFEL GmbH, Schenefeld, Germany
Institute for Computer Engineering, University of Heidelberg, Mannheim, Germany
Institute for Computer Engineering, University of Heidelberg, Mannheim, Germany
Institute for Computer Engineering, University of Heidelberg, Mannheim, Germany
Dipartimento di Ingegneria Industriale, Universita’ di Bergamo, Dalmine (BG), Italy
Politecnico di Milano, Informazione e Bioingegneria and INFN, Sezione di Milano, Milano, Italy
Politecnico di Milano, Informazione e Bioingegneria and INFN, Sezione di Milano, Milano, Italy
Politecnico di Milano, Informazione e Bioingegneria and INFN, Sezione di Milano, Milano, Italy
European XFEL GmbH, Schenefeld, Germany
Institute for Computer Engineering, University of Heidelberg, Mannheim, Germany
Institute for Computer Engineering, University of Heidelberg, Mannheim, Germany
Institute for Computer Engineering, University of Heidelberg, Mannheim, Germany
Dipartimento di Ingegneria Industriale, Universita’ di Bergamo, Dalmine (BG), Italy