Abstract:
Though DBI (Direct Bonding Interconnect) wafer to wafer has been widely reported and already implemented in the industry, in this talk, we will focus on die to die and di...Show MoreMetadata
Abstract:
Though DBI (Direct Bonding Interconnect) wafer to wafer has been widely reported and already implemented in the industry, in this talk, we will focus on die to die and die to wafer assembly, its reliability and readiness to enter the market applications where the stacking yield is paramount.
Published in: 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)
Date of Conference: 21-25 May 2019
Date Added to IEEE Xplore: 13 June 2019
ISBN Information:
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