Hardware Solutions for 5G Mobility

For 5G mobility, the form factors that are familiar with today may be kept the same (such as those in smartphones and iPads) or to be replaced by even smaller ones, such as, a watch, or wearables. In this chapter, the authors present the IC packaging technologies that are on the horizon. They expand the hardware scope to include these components: the multi‐mode multi‐band (MMMB) modem, and the WPAN radio. The authors introduce planar technologies such as, wafer‐level planar (WLP) and large panel planar (LPP) and advanced interconnects for 2.5D and 3D stacking for 5G products. They discuss packaging forms and planar solutions to high‐density and logic (HD&L) and RF‐passives products. The authors also discuss future business model. STATS proposed the following model, post wafer fab processing (PWfP) that is significantly from the current wafer foundries (WFs) and OSAT business model.