Abstract:
Optimizing via placement is becoming important as signaling speeds increase for next generation interconnects. Random placement of ground (GND) return path vias next to s...Show MoreMetadata
Abstract:
Optimizing via placement is becoming important as signaling speeds increase for next generation interconnects. Random placement of ground (GND) return path vias next to signal vias would result in less than optimal performance of an interconnect. It will result in resonances in insertion loss at higher frequencies. In this paper, a methodology for optimal placement of GND vias is proposed that will not only decrease the resonances in insertion loss but also minimize the crosstalk between adjacent differential vias.
Published in: 2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)
Date of Conference: 15-18 October 2017
Date Added to IEEE Xplore: 05 April 2018
ISBN Information:
Electronic ISSN: 2165-4115