Abstract:
This article consists of a collection of slides from the author's conference presentation. Some of the specific areas/topics discussed include: signal integrity; mitigati...Show MoreMetadata
Abstract:
This article consists of a collection of slides from the author's conference presentation. Some of the specific areas/topics discussed include: signal integrity; mitigation strategy; impedance matching; crosstalk; interconnect nonideal effects; high speed interconnect design; jitter; eye diagram; differential High-speed IOs; server board-1U; link SI design; frequency dependency loss; PCB transmission lines; PCB-material loss; copper loss; FR4 PCB loss; surface roughness; and fiberweave impact.
Published in: 2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)
Date of Conference: 07-11 August 2017
Date Added to IEEE Xplore: 23 October 2017
ISBN Information:
Electronic ISSN: 2158-1118