Abstract:
A new high-voltage integrated circuit (HVIC) technology has been developed and optimized for AC/DC power conversion applications that require increased digital content. T...Show MoreMetadata
Abstract:
A new high-voltage integrated circuit (HVIC) technology has been developed and optimized for AC/DC power conversion applications that require increased digital content. This cost-effective process uses 3.3V CMOS and a 180nm backend process to provide about 10X greater digital circuit density compared to conventional 0.5um 5V CMOS solutions. Excellent analog circuit performance is maintained. For the first time, reliable 700V devices are demonstrated using shallow trench isolation (STI) oxide over a double-RESURF drift region.
Date of Conference: 28 May 2017 - 01 June 2017
Date Added to IEEE Xplore: 24 July 2017
ISBN Information:
Electronic ISSN: 1946-0201