180nm HVIC technology for digital AC/DC power conversion

A new high-voltage integrated circuit (HVIC) technology has been developed and optimized for AC/DC power conversion applications that require increased digital content. This cost-effective process uses 3.3V CMOS and a 180nm backend process to provide about 10X greater digital circuit density compared to conventional 0.5um 5V CMOS solutions. Excellent analog circuit performance is maintained. For the first time, reliable 700V devices are demonstrated using shallow trench isolation (STI) oxide over a double-RESURF drift region.