Laser Sintering of Nano-Ag Particle Paste for High-Temperature Electronics Assembly

In this paper, we have investigated a laser-assisted fast nano-Ag sintering process for die attach in power electronic applications. The effects of laser power, irradiation time, and load on microstructure and shear performance of the bonded samples are presented. Moreover, samples sintered by a hotplate were also studied as a comparison. The results indicate that the die-attach process using the nano-Ag material can be realized within 1 min in the laser-assisted sintering method. In general, better shear strength was obtained with increasing laser power, irradiation time, and load. The shear strength of samples irradiated by 2-5 min of laser beam was comparable to that of the samples sintered on the hotplate for 80 min.