Abstract:
Vertically integrated circuits (3-D ICs) may revitalize Moore's law scaling which has slowed down in recent years. 3-D stacking is an emerging technology that stacks mult...Show MoreMetadata
Abstract:
Vertically integrated circuits (3-D ICs) may revitalize Moore's law scaling which has slowed down in recent years. 3-D stacking is an emerging technology that stacks multiple dies vertically to achieve higher transistor density independent of device scaling. They provide high-density vertical interconnects, which can reduce interconnect power and delay. Moreover, 3-D ICs can integrate disparate circuit technologies into a single chip, thereby unlocking new system-on-chip architectures that do not exist in 2-D technology. While 3-D integration could bring new architectural opportunities and significant performance enhancement, new thermal, power delivery, signal integrity and reliability challenges emerge as power consumption grows, and device density increases. Moreover, the significant expansion of CPU design space in 3-D requires new architectural models and methodologies for design space exploration (DSE). New design tools and methods are required to address these 3-D-specific challenges. This keynote paper focuses on the state of the art, ongoing advances and future challenges of 3-D IC design tools and methods. The primary focus of this paper is TSV-based 3-D ICs, although we also discuss recent advances in monolithic 3-D ICs. The objective of this paper is to provide a unified perspective on the fundamental opportunities and challenges posed by 3-D ICs especially from the context of design tools and methods. We also discuss the methodology of co-design to address more complicated and interdependent design problems in 3-D IC, and conclude with a discussion of the remaining challenges and open problems that must be overcome to make 3-D IC technology commercially viable.
Published in: IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems ( Volume: 36, Issue: 10, October 2017)
Funding Agency:
Department of Electrical and Computer Engineering, University of Maryland, College Park, MD, USA
Tiantao Lu (S’12) received the B.S. degree from the Department of Electrical Engineering and Computer Science, Peking University, Beijing, China, in 2011, and the Ph.D. degree from the Department of Electrical and Computer Engineering, University of Maryland at College Park, College Park, MD, USA, in 2016.
He is currently a Lead Software Engineer with Cadence, San Jose, CA, USA. His current research interests include physi...Show More
Tiantao Lu (S’12) received the B.S. degree from the Department of Electrical Engineering and Computer Science, Peking University, Beijing, China, in 2011, and the Ph.D. degree from the Department of Electrical and Computer Engineering, University of Maryland at College Park, College Park, MD, USA, in 2016.
He is currently a Lead Software Engineer with Cadence, San Jose, CA, USA. His current research interests include physi...View more
Department of Electrical and Computer Engineering, University of Maryland, College Park, MD, USA
Caleb Serafy (S’12) received the B.S. degree in computer engineering and the M.S. degree in electrical engineering from Binghamton University, Binghamton, NY, USA, in 2010 and 2011, respectively, and the Ph.D. degree from the Department of Electrical and Computer Engineering, University of Maryland (UMD) at College Park, College Park, MD, USA, in 2016.
He is currently a Senior Hardware Engineer with Oracle, Santa Clara, CA...Show More
Caleb Serafy (S’12) received the B.S. degree in computer engineering and the M.S. degree in electrical engineering from Binghamton University, Binghamton, NY, USA, in 2010 and 2011, respectively, and the Ph.D. degree from the Department of Electrical and Computer Engineering, University of Maryland (UMD) at College Park, College Park, MD, USA, in 2016.
He is currently a Senior Hardware Engineer with Oracle, Santa Clara, CA...View more
Department of Electrical and Computer Engineering, University of Maryland, College Park, MD, USA
Zhiyuan Yang received the B.S. degree from Zhejiang University, Hangzhou, China, in 2013. He is currently pursuing the Ph.D. degree in electrical and computer engineering with the University of Maryland (UMD) at College Park, College Park, MD, USA.
He has been a Research Assistant with UMD, since 2014, under the supervision of Prof. A. Srivastava. His current research interests include 3-D integrated circuits, power delive...Show More
Zhiyuan Yang received the B.S. degree from Zhejiang University, Hangzhou, China, in 2013. He is currently pursuing the Ph.D. degree in electrical and computer engineering with the University of Maryland (UMD) at College Park, College Park, MD, USA.
He has been a Research Assistant with UMD, since 2014, under the supervision of Prof. A. Srivastava. His current research interests include 3-D integrated circuits, power delive...View more
School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA, USA
Sandeep Kumar Samal (S’12) received the B.Tech. degree in electronics and electrical communication engineering from the Indian Institute of Technology Kharagpur, Kharagpur, India, in 2012, and the M.S. degree in electrical and computer engineering from the Georgia Institute of Technology, Atlanta, GA, USA, in 2013, where he is currently pursuing the Ph.D. degree with the School of Electrical and Computer Engineering.
He ha...Show More
Sandeep Kumar Samal (S’12) received the B.Tech. degree in electronics and electrical communication engineering from the Indian Institute of Technology Kharagpur, Kharagpur, India, in 2012, and the M.S. degree in electrical and computer engineering from the Georgia Institute of Technology, Atlanta, GA, USA, in 2013, where he is currently pursuing the Ph.D. degree with the School of Electrical and Computer Engineering.
He ha...View more
School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA, USA
Sung Kyu Lim (S’94–M’00–SM’05) received the B.S., M.S., and Ph.D. degrees from the University of California at Los Angeles, Los Angeles, CA, USA, in 1994, 1997, and 2000, respectively.
He joined the School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA, USA, in 2001, where he is currently the Dan Fielder Endowed Chair Professor. His current research interests include modeling, architec...Show More
Sung Kyu Lim (S’94–M’00–SM’05) received the B.S., M.S., and Ph.D. degrees from the University of California at Los Angeles, Los Angeles, CA, USA, in 1994, 1997, and 2000, respectively.
He joined the School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA, USA, in 2001, where he is currently the Dan Fielder Endowed Chair Professor. His current research interests include modeling, architec...View more
Department of Electrical and Computer Engineering, University of Maryland, College Park, MD, USA
Ankur Srivastava (M’02–SM’15) received the B.Tech. degree in electrical engineering from the Indian Institute of Technology Delhi, New Delhi, India, in 1998, and the Ph.D. degree in computer science from University of California at Los Angeles (UCLA), Los Angeles, CA, USA, in 2002.
His current research interests include high performance, low power and secure electronic systems and applications such as computer vision, data...Show More
Ankur Srivastava (M’02–SM’15) received the B.Tech. degree in electrical engineering from the Indian Institute of Technology Delhi, New Delhi, India, in 1998, and the Ph.D. degree in computer science from University of California at Los Angeles (UCLA), Los Angeles, CA, USA, in 2002.
His current research interests include high performance, low power and secure electronic systems and applications such as computer vision, data...View more
Contents Department of Electrical and Computer Engineering, University of Maryland, College Park, MD, USA
Tiantao Lu (S’12) received the B.S. degree from the Department of Electrical Engineering and Computer Science, Peking University, Beijing, China, in 2011, and the Ph.D. degree from the Department of Electrical and Computer Engineering, University of Maryland at College Park, College Park, MD, USA, in 2016.
He is currently a Lead Software Engineer with Cadence, San Jose, CA, USA. His current research interests include physical design methodology for high-performance thermal-aware and reliable 3-D ICs.
Tiantao Lu (S’12) received the B.S. degree from the Department of Electrical Engineering and Computer Science, Peking University, Beijing, China, in 2011, and the Ph.D. degree from the Department of Electrical and Computer Engineering, University of Maryland at College Park, College Park, MD, USA, in 2016.
He is currently a Lead Software Engineer with Cadence, San Jose, CA, USA. His current research interests include physical design methodology for high-performance thermal-aware and reliable 3-D ICs.View more
Department of Electrical and Computer Engineering, University of Maryland, College Park, MD, USA
Caleb Serafy (S’12) received the B.S. degree in computer engineering and the M.S. degree in electrical engineering from Binghamton University, Binghamton, NY, USA, in 2010 and 2011, respectively, and the Ph.D. degree from the Department of Electrical and Computer Engineering, University of Maryland (UMD) at College Park, College Park, MD, USA, in 2016.
He is currently a Senior Hardware Engineer with Oracle, Santa Clara, CA, USA. His current research interests include thermal-electrical-physical co-design of 3-D ICs and power delivery network modeling and optimization.
Dr. Serafy was a recipient of the Distinguished Graduate Fellowship, the Summer Research Fellowship, and the Distinguished Dissertation Fellowship while at UMD.
Caleb Serafy (S’12) received the B.S. degree in computer engineering and the M.S. degree in electrical engineering from Binghamton University, Binghamton, NY, USA, in 2010 and 2011, respectively, and the Ph.D. degree from the Department of Electrical and Computer Engineering, University of Maryland (UMD) at College Park, College Park, MD, USA, in 2016.
He is currently a Senior Hardware Engineer with Oracle, Santa Clara, CA, USA. His current research interests include thermal-electrical-physical co-design of 3-D ICs and power delivery network modeling and optimization.
Dr. Serafy was a recipient of the Distinguished Graduate Fellowship, the Summer Research Fellowship, and the Distinguished Dissertation Fellowship while at UMD.View more
Department of Electrical and Computer Engineering, University of Maryland, College Park, MD, USA
Zhiyuan Yang received the B.S. degree from Zhejiang University, Hangzhou, China, in 2013. He is currently pursuing the Ph.D. degree in electrical and computer engineering with the University of Maryland (UMD) at College Park, College Park, MD, USA.
He has been a Research Assistant with UMD, since 2014, under the supervision of Prof. A. Srivastava. His current research interests include 3-D integrated circuits, power delivery of 3-D ICs, and thermal-architectural-physical co-design of 3-D ICs with micro-fluidic cooling.
Mr. Yang was a recipient of the Distinguished Graduate Fellowship from UMD.
Zhiyuan Yang received the B.S. degree from Zhejiang University, Hangzhou, China, in 2013. He is currently pursuing the Ph.D. degree in electrical and computer engineering with the University of Maryland (UMD) at College Park, College Park, MD, USA.
He has been a Research Assistant with UMD, since 2014, under the supervision of Prof. A. Srivastava. His current research interests include 3-D integrated circuits, power delivery of 3-D ICs, and thermal-architectural-physical co-design of 3-D ICs with micro-fluidic cooling.
Mr. Yang was a recipient of the Distinguished Graduate Fellowship from UMD.View more
School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA, USA
Sandeep Kumar Samal (S’12) received the B.Tech. degree in electronics and electrical communication engineering from the Indian Institute of Technology Kharagpur, Kharagpur, India, in 2012, and the M.S. degree in electrical and computer engineering from the Georgia Institute of Technology, Atlanta, GA, USA, in 2013, where he is currently pursuing the Ph.D. degree with the School of Electrical and Computer Engineering.
He has authored over 20 publications in refereed journals and conferences. His current research interests include low power and reliable digital design, modeling, and analysis using through-silicon-via-based and monolithic 3-D IC technology.
Sandeep Kumar Samal (S’12) received the B.Tech. degree in electronics and electrical communication engineering from the Indian Institute of Technology Kharagpur, Kharagpur, India, in 2012, and the M.S. degree in electrical and computer engineering from the Georgia Institute of Technology, Atlanta, GA, USA, in 2013, where he is currently pursuing the Ph.D. degree with the School of Electrical and Computer Engineering.
He has authored over 20 publications in refereed journals and conferences. His current research interests include low power and reliable digital design, modeling, and analysis using through-silicon-via-based and monolithic 3-D IC technology.View more
School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA, USA
Sung Kyu Lim (S’94–M’00–SM’05) received the B.S., M.S., and Ph.D. degrees from the University of California at Los Angeles, Los Angeles, CA, USA, in 1994, 1997, and 2000, respectively.
He joined the School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA, USA, in 2001, where he is currently the Dan Fielder Endowed Chair Professor. His current research interests include modeling, architecture, and electronic design automation for 3-D ICs.
Dr. Lim was a recipient of the National Science Foundation Faculty Early Career Development (CAREER) Award in 2006, Distinguished Service Award in 2008, and the Best Paper Awards from the IEEE Asian Test Symposium in 2012 and the IEEE International Interconnect Technology Conference in 2014. He was on the Advisory Board of the ACM Special Interest Group on Design Automation from 2003 to 2008. He was an Associate Editor of the IEEE Transactions on Very Large Scale Integration Systems from 2007 to 2009. He has been an Associate Editor of the IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems since 2013. He has served on the Technical Program Committee of several premier conferences in EDA.
Sung Kyu Lim (S’94–M’00–SM’05) received the B.S., M.S., and Ph.D. degrees from the University of California at Los Angeles, Los Angeles, CA, USA, in 1994, 1997, and 2000, respectively.
He joined the School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA, USA, in 2001, where he is currently the Dan Fielder Endowed Chair Professor. His current research interests include modeling, architecture, and electronic design automation for 3-D ICs.
Dr. Lim was a recipient of the National Science Foundation Faculty Early Career Development (CAREER) Award in 2006, Distinguished Service Award in 2008, and the Best Paper Awards from the IEEE Asian Test Symposium in 2012 and the IEEE International Interconnect Technology Conference in 2014. He was on the Advisory Board of the ACM Special Interest Group on Design Automation from 2003 to 2008. He was an Associate Editor of the IEEE Transactions on Very Large Scale Integration Systems from 2007 to 2009. He has been an Associate Editor of the IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems since 2013. He has served on the Technical Program Committee of several premier conferences in EDA.View more
Department of Electrical and Computer Engineering, University of Maryland, College Park, MD, USA
Ankur Srivastava (M’02–SM’15) received the B.Tech. degree in electrical engineering from the Indian Institute of Technology Delhi, New Delhi, India, in 1998, and the Ph.D. degree in computer science from University of California at Los Angeles (UCLA), Los Angeles, CA, USA, in 2002.
His current research interests include high performance, low power and secure electronic systems and applications such as computer vision, data, and storage centers and sensor networks. He has published numerous papers on the above fields at prestigious venues.
Dr. Srivastava was a recipient of the prestigious Outstanding Dissertation Award from the Computer Science Department of UCLA in 2002. His research and teaching contributions have also been recognized through various awards. He has been a part of the Technical Program and Organizing Committees of several conferences, such as ICCAD, DAC, ISPD, ICCD, GLSVLSI, and HOST. He has served as an Associate Editor for the IEEE Transactions on Very Large Scale Integration (VLSI) Systems, the IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, and the Integration: VLSI Journal.
Ankur Srivastava (M’02–SM’15) received the B.Tech. degree in electrical engineering from the Indian Institute of Technology Delhi, New Delhi, India, in 1998, and the Ph.D. degree in computer science from University of California at Los Angeles (UCLA), Los Angeles, CA, USA, in 2002.
His current research interests include high performance, low power and secure electronic systems and applications such as computer vision, data, and storage centers and sensor networks. He has published numerous papers on the above fields at prestigious venues.
Dr. Srivastava was a recipient of the prestigious Outstanding Dissertation Award from the Computer Science Department of UCLA in 2002. His research and teaching contributions have also been recognized through various awards. He has been a part of the Technical Program and Organizing Committees of several conferences, such as ICCAD, DAC, ISPD, ICCD, GLSVLSI, and HOST. He has served as an Associate Editor for the IEEE Transactions on Very Large Scale Integration (VLSI) Systems, the IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, and the Integration: VLSI Journal.View more
