Abstract:
This paper deals with the characterization of mechanical material properties of silver sintered bond lines in power electronic modules. Two different methods for obtainin...Show MoreMetadata
Abstract:
This paper deals with the characterization of mechanical material properties of silver sintered bond lines in power electronic modules. Two different methods for obtaining the mechanical properties were applied. Silver sintered specimens were manufactured for both tensile and nanoindentation experiments. The manufacturing procedure was the same as for the silver sintering process in die attachment for power electronics. In tensile tests the specimens showed at room temperature brittle behaviour whereas at elevated temperature large ideal plastic deformation with reduced Young's modulus could be observed. The mechanical properties are depending strongly on sintering parameters and on the whole manufacturing process. By combination of nanoindentation and scanning electron microscopy it could be revealed that the properties of the bond lines depending strongly on its location on the sample. The investigation of the time dependent behavior showed small values and little dependency of the porosity at room temperature.
Date of Conference: 08-10 March 2016
Date Added to IEEE Xplore: 07 November 2016
Print ISBN:978-3-8007-4171-7
Conference Location: Nuremberg, Germany
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- Index Terms
- Mechanical Properties ,
- Scanning Electron Microscopy ,
- Young’s Modulus ,
- Elevated Temperature ,
- Manufacturing Process ,
- Power Electronics ,
- Tensile Experiments ,
- Large Plastic Deformation ,
- Nanoindentation Experiments ,
- Tensile Strength ,
- Strain Rate ,
- Penetration Depth ,
- Yield Strength ,
- Test Specimens ,
- Crack Propagation ,
- Higher Slope ,
- Strain Measurements ,
- Flow Stress ,
- Fracture Strain ,
- Bone Shape ,
- Strain Rate Sensitivity ,
- Power Electronic Systems ,
- Creep Deformation ,
- Dog Bone ,
- Slope Of Ln ,
- Edge Of Bone ,
- Power Electronic Devices
Keywords assist with retrieval of results and provide a means to discovering other relevant content. Learn more.
- Index Terms
- Mechanical Properties ,
- Scanning Electron Microscopy ,
- Young’s Modulus ,
- Elevated Temperature ,
- Manufacturing Process ,
- Power Electronics ,
- Tensile Experiments ,
- Large Plastic Deformation ,
- Nanoindentation Experiments ,
- Tensile Strength ,
- Strain Rate ,
- Penetration Depth ,
- Yield Strength ,
- Test Specimens ,
- Crack Propagation ,
- Higher Slope ,
- Strain Measurements ,
- Flow Stress ,
- Fracture Strain ,
- Bone Shape ,
- Strain Rate Sensitivity ,
- Power Electronic Systems ,
- Creep Deformation ,
- Dog Bone ,
- Slope Of Ln ,
- Edge Of Bone ,
- Power Electronic Devices