Joint Properties and Thermomechanical Reliability of Nanoparticle-Added Sn-Ag-Cu Solder Paste

Joint properties of a La
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-nanoparticle-added Sn-3.0wt%Ag-0.5wt%Cu (SAC305) solder were investigated in this study. Nano-composite solders which contain second-phase nanoparticles in the solder matrix are known to possess high mechanical strength and creep resistance. In this study, La
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nanoparticles were mixed with a Sn-Ag-Cu solder paste and the solder joint properties as well as the process ability was evaluated in this study. The slump properties of the nano-composite solder paste was similar to that of the conventional solder paste. The La
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-added SAC305 nano-composite solder paste had higher spread area than conventional SAC305 solders. The nanocomposite solder paste had higher toughness than the conventional solder paste. The La
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-- added SAC305 solder paste also showed excellent thermal shock resistance compared with the conventional SAC305 solder.