Abstract:
The purpose of this Cooling device is to provide an energy efficient solution to cater for the ever increasing cooling requirements for IT and HVAC systems in the Data Ce...Show MoreMetadata
Abstract:
The purpose of this Cooling device is to provide an energy efficient solution to cater for the ever increasing cooling requirements for IT and HVAC systems in the Data Centre and Telecoms sectors. The objective of this document is to discuss an energy rating standard for Printed Circuit Board component's which will lead to the Electronics Industry introducing an integral self cooling method of rejecting heat. The present reliance on a separate mechanical cooling system powered by conventional Fan and Compressor motors is clearly unsustainable and is in no uncertain terms passing the Carbon buck to the HVACR industry.
Published in: 2015 21st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
Date of Conference: 30 September 2015 - 02 October 2015
Date Added to IEEE Xplore: 25 January 2016
Electronic ISBN:978-1-4673-9705-6
Contents 