Optical quilt packaging: A new chip-to-chip optical coupling and alignment process for modular sensors | IEEE Conference Publication | IEEE Xplore

Optical quilt packaging: A new chip-to-chip optical coupling and alignment process for modular sensors


Abstract:

A wide-bandwidth, highly efficient method of inter-chip waveguide coupling suitable for on-chip, mid-infrared sensing is discussed. Simulations and preliminary fabricatio...Show More

Abstract:

A wide-bandwidth, highly efficient method of inter-chip waveguide coupling suitable for on-chip, mid-infrared sensing is discussed. Simulations and preliminary fabrication work on laser-to-waveguide coupling are presented, with losses predicted to be better than 6 dB.
Date of Conference: 08-13 June 2014
Date Added to IEEE Xplore: 18 December 2014
Electronic ISBN:978-1-55752-999-2
Print ISSN: 2160-8989
Conference Location: San Jose, CA, USA
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