Abstract:
Solid metallic connections have been successfully formed between two standard levels of metallization using a focused IR laser system. This new process of laser formed co...Show MoreMetadata
Abstract:
Solid metallic connections have been successfully formed between two standard levels of metallization using a focused IR laser system. This new process of laser formed connections has been used to link chains with resistances of less than 0.8 /spl Omega/ per connection. Commercial laser repair systems used extensively by the memory industry were employed to perform over 100000 individual links over a wide set of laser parameters without failure. This technology has the potential to replace laser fuse cutting techniques to program wiring in silicon-on-silicon, wafer scale integration (WSI), and system-on-a-chip applications. Furthermore, because it is an additive process and the passivation remains completely intact, it lends itself to redundancy with perfect yield and exceptional reliability.
Published in: Proceedings of the IEEE 1998 Custom Integrated Circuits Conference (Cat. No.98CH36143)
Date of Conference: 14-14 May 1998
Date Added to IEEE Xplore: 06 August 2002
Print ISBN:0-7803-4292-5
