Abstract:
Via-filling is a critical and costly process of TSV fabrication and is usually realized by Cu-plating, CVD, etc. Liquid metal via-filling made by pressing solder from a m...Show MoreMetadata
Abstract:
Via-filling is a critical and costly process of TSV fabrication and is usually realized by Cu-plating, CVD, etc. Liquid metal via-filling made by pressing solder from a melting solder pool into via holes faces problems of wafer breakage caused by pressure differential and cutting off solder-vias from the pool. A liquid bridge pinch-off effect based cutting-off method, together with a `wafer sandwich' structure, has the feasibility to solve the above problems faced by the pressure assisted liquid metal via-filling approach.
Date of Conference: 26-30 January 2014
Date Added to IEEE Xplore: 13 March 2014
Electronic ISBN:978-1-4799-3509-3
Print ISSN: 1084-6999
Contents 