Board level reliability testing of hermetic packages equipped with high-rel interconnection solutions and dedicated to space applications

e2v semiconductors has received worldwide renowned recognition for supplying high speed Broadband Data Converters for a multitude of leading-edge signal conversion applications. If special attention is paid to the development and optimization of the products electrical specifications, packaging and board reliability performances are expected to be of the same caliber. With this in mind, 2012 has seen e2v investigate new interconnection solutions as part of a study into board level reliability. Three different high-end interconnection solutions have been explored, including copper-reinforced solder columns and polymer-cored solder balls. The board reliability study has been conducted per IPC-9701 and ECSS-Q-ST-70-38C standards. 1500 temperature cycles have been performed in the range of -55°C to 100°C and continuous electrical monitoring of the test vehicles has been conducted as well as continuous temperature monitoring. A routine reading of each components resistance was carried out every 30 seconds. e2v's paper will compare the behavior of Ceramic Grid Array (CGA) packages equipped with Solder Column Interposers (SCI) to CGAs equipped with SIX SIGMA columns as well as Micropearl-SOL Polymer balls. In particular, the document will highlight the reliability testing results for the Al₂O₃ Ceramic Grid Array technology when soldered on FR4 printed circuit boards and submitted to space-applications-oriented temperature cycles. High Power Light Microscopy (HPLM) and Scanning Electron Microscope (SEM) images as well as compositional data gathered from micro-section analyses of solder joints will be provided.