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Combined molding package (proximity sensor) | IEEE Conference Publication | IEEE Xplore

Combined molding package (proximity sensor)


Abstract:

Proximity sensors, which are designed to detect the presence of nearby objects without any physical contact. Proximity sensor basically employ an Infra Red LED transceive...Show More

Abstract:

Proximity sensors, which are designed to detect the presence of nearby objects without any physical contact. Proximity sensor basically employ an Infra Red LED transceiver and Light receiver to achieve proximity detection purpose.
Date of Conference: 06-08 November 2012
Date Added to IEEE Xplore: 30 May 2013
ISBN Information:

ISSN Information:

Conference Location: Ipoh, Malaysia

References

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