I. Introduction
There is an increasing interest in exploring the millimeter-wave (mmW) spectrum, 30–300 GHz, for various wideband applications, including short-range radar [1] and Gbit/s wireless communication [2]. While maintaining a high efficiency in these systems, it is challenging to assemble antennas with monolithic microwave integrated circuit (MMIC) radio front-ends via wire-bonded interfaces or connectors. The solution is to flip-chip (FC) assemble a multichip module (MCM) and use on-chip integration of efficient antennas and MMICs [3]. This results in reduced guiding and mismatch losses, but also allows high-precision fabrication techniques. Highly integrated antennas may be codesigned with active circuitry, allowing arbitrarily designed feed lines in between components, including direct integration.