VAX 9000 packaging-the multi chip unit | IEEE Conference Publication | IEEE Xplore

VAX 9000 packaging-the multi chip unit


Abstract:

The VAX 9000 achieves its high performance through the use of high-speed hardware and architectural features that reduce both cycle time and cycles per instruction execut...Show More

First Page of the Article

Abstract:

The VAX 9000 achieves its high performance through the use of high-speed hardware and architectural features that reduce both cycle time and cycles per instruction execution. The multi chip unit (MCU), the heart of the high-density packaging approach which makes the fast cycle time possible, is described. The performance analysis that led to the selection of this packaging technology is reviewed. This is followed by a brief description of the semiconductors and an overview of the MCU, its components, and their performance. The VAX 9000 logic is based on the Motorola MCAIII emitter-coupled-logic gate array technology. Housing and connector features are briefly examined.<>
Date of Conference: 26 February 1990 - 02 March 1990
Date Added to IEEE Xplore: 06 August 2002
Print ISBN:0-8186-2028-5
Conference Location: San Francisco, CA, USA

First Page of the Article


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