Study of dry etching process using SF6 and CF4/O2 for Nb/NbxSi1−x/Nb Josephson-junction fabrication | IEEE Conference Publication | IEEE Xplore
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Study of dry etching process using SF6 and CF4/O2 for Nb/NbxSi1−x/Nb Josephson-junction fabrication

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Qing Zhong; Wenhui Cao; Jinjin Li; Yuan Zhong; Xueshen Wang
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Abstract:

Both SF6 and CF4 are plasma chemistries that are often used during dry etching in fabricating the niobium Josephson junctions. This paper presents the preliminary experim...Show More

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Abstract:

Both SF6 and CF4 are plasma chemistries that are often used during dry etching in fabricating the niobium Josephson junctions. This paper presents the preliminary experimental results of using these two etches on etching Nb/NbxSi1-x/Nb Josephson junctions in NIM.
Published in: 2012 Conference on Precision electromagnetic Measurements
Date of Conference: 01-06 July 2012
Date Added to IEEE Xplore: 30 July 2012
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ISSN Information:

DOI: 10.1109/CPEM.2012.6250653
Conference Location: Washington, DC, USA
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