Triple patterning aware routing and its comparison with double patterning aware routing in 14nm technology

As technology continues to scale to 14nm node, Double Patterning Lithography (DPL) is pushed to near its limit. Triple Patterning Lithography (TPL) is a considerable and natural extension along the paradigm of DPL. With an extra mask to accommodate the features, TPL can be used to eliminate the unresolvable conflicts and minimize the number of stitches, which are pervasive in DPL process, and thus smoothen the layout decomposition step. Considering TPL during routing stage explores a larger solution space and can further improve the layout decomposability. In this paper, we propose the first triple patterning aware detailed routing scheme, and compare its performance with the double patterning version in 14nm node. Experimental results show that, using TPL, the conflicts can be resolved much more easily and the stitches can be significantly reduced in contrast to DPL.