A comparison of power supply planes in thick and thin film MCM's | IEEE Conference Publication | IEEE Xplore

A comparison of power supply planes in thick and thin film MCM's


Abstract:

A method that would allow accurate modeling of arbitrarily shaped planes with bypass capacitors has been developed and verified with thick and thin film MCM substrates. T...Show More

Abstract:

A method that would allow accurate modeling of arbitrarily shaped planes with bypass capacitors has been developed and verified with thick and thin film MCM substrates. The method is used to explore potential design choices for a large MCM with many simultaneously switching drivers.
Date of Conference: 02-04 November 1994
Date Added to IEEE Xplore: 06 August 2002
Print ISBN:0-7803-2411-0
Conference Location: Monterey, CA, USA

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