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3D technology roadmap and status | IEEE Conference Publication | IEEE Xplore

Abstract:

The semiconductor industry is witnessing a major shift towards heterogeneous 3D integration. Whether companies are active in high performance or consumer markets systems,...Show More

Abstract:

The semiconductor industry is witnessing a major shift towards heterogeneous 3D integration. Whether companies are active in high performance or consumer markets systems, 3D offers a myriad of opportunities. We will review the different opportunities, indicate process availability and remaining challenges from both design and technology perspective.
Date of Conference: 08-12 May 2011
Date Added to IEEE Xplore: 04 July 2011
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ISSN Information:

Conference Location: Dresden, Germany

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