Abstract:
The glass-passivated, face-down semiconductor chip joining technology employed in IBM's SLT (Solid Logic Technology), has become not only a fundamental element in the hyb...Show MoreMetadata
Abstract:
The glass-passivated, face-down semiconductor chip joining technology employed in IBM's SLT (Solid Logic Technology), has become not only a fundamental element in the hybrid circuitry of System/360 but also the basis for later metallurgical designs. The “flip-chip,” copper ball terminal, solder reflow technique is comprehensively reviewed and a discussion is given of its extension, through the use of ductile, all-solder terminals, to monolithic applications.
Published in: IBM Journal of Research and Development ( Volume: 13, Issue: 3, May 1969)
DOI: 10.1147/rd.133.0226
Keywords assist with retrieval of results and provide a means to discovering other relevant content. Learn more.
- Index Terms
- Flip-chip ,
- Semiconductor Chip ,
- High Temperature ,
- Thin Films ,
- Chemical Properties ,
- High Resistance ,
- Melting Point ,
- Film Thickness ,
- Surface Tension ,
- Airtight ,
- Solid Solution ,
- Contact Resistance ,
- Glass Surface ,
- Residual Stress ,
- Active Devices ,
- Metal Film ,
- Thermal Shock ,
- Eutectic Mixture ,
- Complex Modulation ,
- Bottom Hole ,
- Solder Joints ,
- Electrode Substrate ,
- Semiconductor Devices ,
- Sintering ,
- Tribrid ,
- Si Alloy
Keywords assist with retrieval of results and provide a means to discovering other relevant content. Learn more.
- Index Terms
- Flip-chip ,
- Semiconductor Chip ,
- High Temperature ,
- Thin Films ,
- Chemical Properties ,
- High Resistance ,
- Melting Point ,
- Film Thickness ,
- Surface Tension ,
- Airtight ,
- Solid Solution ,
- Contact Resistance ,
- Glass Surface ,
- Residual Stress ,
- Active Devices ,
- Metal Film ,
- Thermal Shock ,
- Eutectic Mixture ,
- Complex Modulation ,
- Bottom Hole ,
- Solder Joints ,
- Electrode Substrate ,
- Semiconductor Devices ,
- Sintering ,
- Tribrid ,
- Si Alloy
