Cathodic delamination of methyl methacrylate-based dry film polymers on copper

Studies of the bond degradation between a laminated organic coating and a copper substrate have been carried out using electrochemical techniques. The failure of the bond is attributed to a cathodic reaction which occurs under the coating. The rates of delamination are shown to be affected by delay time after exposure, temperature, applied potential, composition of the electrolyte, and surface abrasion prior to application of the coating.