Abstract:
This paper presents preliminary results of a copper-based direct bond interconnect (DBIreg) 3D integration process that has been developed to leverage foundry standard co...Show MoreMetadata
Abstract:
This paper presents preliminary results of a copper-based direct bond interconnect (DBIreg) 3D integration process that has been developed to leverage foundry standard copper dual damascene and Ziptronix bond technology to achieve scalable, very low Cost-of-Ownership, 3D interconnects with minimum foundry adoption barrier. Results achieved include 100% operable arrays of 72,500 3D copper DBIreg interconnections on a 25 micron pitch with a 125degC thermal budget and 10 micron pitch 3D copper DBIreg interconnections with a 350degC thermal budget. DBIreg contact resistance and resistivity achieved are < 50 mOhm / connection and < 0.45 Ohm-um2, respectively, using three or four micron diameter Cu DBIreg plugs and a TiW barrier layer. Reliability results include bare die that pass temperature cycling and HAST JEDEC tests.
Date of Conference: 28-30 September 2009
Date Added to IEEE Xplore: 30 October 2009
ISBN Information:
Keywords assist with retrieval of results and provide a means to discovering other relevant content. Learn more.
- IEEE Keywords
- Index Terms
- Impedance ,
- Contact Resistance ,
- Temperature Cycles ,
- Barrier Layer ,
- Microns In Diameter ,
- Thermal Budget ,
- 3D Integration ,
- Minimum Barrier ,
- Scanning Electron Microscopy ,
- Heat Treatment ,
- Crystallite ,
- Bond Strength ,
- Distinct Structures ,
- Thermal Expansion ,
- Control Limits ,
- Patent Applications ,
- Grain Growth ,
- Silicon Nitride ,
- Direct Oxidation ,
- Back-end-of-line ,
- Single Connection ,
- Low Copper ,
- Heterogeneous Integration ,
- Direct Metal ,
- Interfacial Bond ,
- 3D Stacks ,
- Direct Interface
- Author Keywords
Keywords assist with retrieval of results and provide a means to discovering other relevant content. Learn more.
- IEEE Keywords
- Index Terms
- Impedance ,
- Contact Resistance ,
- Temperature Cycles ,
- Barrier Layer ,
- Microns In Diameter ,
- Thermal Budget ,
- 3D Integration ,
- Minimum Barrier ,
- Scanning Electron Microscopy ,
- Heat Treatment ,
- Crystallite ,
- Bond Strength ,
- Distinct Structures ,
- Thermal Expansion ,
- Control Limits ,
- Patent Applications ,
- Grain Growth ,
- Silicon Nitride ,
- Direct Oxidation ,
- Back-end-of-line ,
- Single Connection ,
- Low Copper ,
- Heterogeneous Integration ,
- Direct Metal ,
- Interfacial Bond ,
- 3D Stacks ,
- Direct Interface
- Author Keywords