Abstract:
Future high performance systems may incorporate liquid cooling to the board. These systems will be assembled using commercially available components and subsystems, which...Show MoreMetadata
Abstract:
Future high performance systems may incorporate liquid cooling to the board. These systems will be assembled using commercially available components and subsystems, which include the pump, liquid coolant, tubing and connections, heat exchanger, and cold plate. Liquid cooling systems are known to be susceptible to more degradation and failure mechanisms than conventional solid metal heatsinks, heat pipe heatsinks or vapor chamber heatsinks. Component and system providers need guidelines to ensure that their products meet projected reliability requirements. A generic preliminary specification has been assembled based on industry standards and information collected from leading equipment suppliers.
Date of Conference: 15-19 March 2009
Date Added to IEEE Xplore: 03 April 2009
ISBN Information:
Print ISSN: 1065-2221