Source/drain-tied bottom gate MOSFET for device reliability improvement | IEEE Conference Publication | IEEE Xplore

Source/drain-tied bottom gate MOSFET for device reliability improvement


Abstract:

The paper presents a non-classical architecture called the bottom gate MOSFET with source/drain tie (S/D-tied BG) to improve device reliability. S/D-tied BG MOSFET not on...Show More

Abstract:

The paper presents a non-classical architecture called the bottom gate MOSFET with source/drain tie (S/D-tied BG) to improve device reliability. S/D-tied BG MOSFET not only effectively reduce the effects of self-heating but also slightly suppress the short-channel effects.
Date of Conference: 11-14 May 2008
Date Added to IEEE Xplore: 09 July 2008
ISBN Information:
Conference Location: Nis, Serbia and Montenegro

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