Abstract:
A methodology characterizing the strength of PDMS bonding has been proposed. This method employs a blister test to measure and a line force model to describe the bonding ...Show MoreMetadata
Abstract:
A methodology characterizing the strength of PDMS bonding has been proposed. This method employs a blister test to measure and a line force model to describe the bonding strength. The blister test provides us a close approximation to the bonding failure modes under field-used situations. The line force model is a general means to study the bonding strength. A series of the blister tests on PDMS samples have been conducted. The effects of sample size and structured surface on the bonding strength have been examined.
Published in: TRANSDUCERS 2007 - 2007 International Solid-State Sensors, Actuators and Microsystems Conference
Date of Conference: 10-14 June 2007
Date Added to IEEE Xplore: 24 September 2007
ISBN Information:
Contents 