3D-SoC Thermal Design Optimization and ANSYS Simulation

The three dimensional SOC brings high density and function with one critical tail of thermal design. In order to optimize the self-heat problem, the author work in three steps aiming at 2006 data of 2005-ITRS, firstly to build a 3D-SOC thermal model in concern for three factors of temperature rise based on my die-stack definition and vertical interconnection description of Stanford's modified Rent rule, secondly to compute optimal thermal design of embedded micro-C-pipe radiator with equivalent thermal conductivity for copper inner-medium, and then to simulate my ANSYS model of quasi 3D-SOC with Cu layer number change. The consistent compared results show that fractal structure of embedded micro-C-pipe radiator and obvious decrease of Cu layer-number are essential to 3D-SOC thermal design optimization